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  • Tergeo-EM for TEM sample rods cleaning etc tabletop plasma cleaners Model:Tergeo / Tergeo-plus / Tergeo-EM
    PIE tabletop plasma cleaners include Tergeo, Tergeo plus and Tergeo EM plasma treatment systems. Tabletop plasma cleaners are designed for contamination removal on SEM and TEM samples. Tergeo EM plasma cleaner is a special edition of Tergeo series plasma cleaner designed for SEM/TEM sample cleaning application. It replaces the quartz window in standard Tergeo plasma cleaner with a stainless steel adapter that can accept two TEM sample rods from different TEM vendors. Pin mount SEM sample holders can be placed on the internal quartz plate for cleaning.Tergeo EM plasma cleaner can meet all the requirements from high speed cleaning for heavily contaminated apertures and electrodes in electron optics column to gentle cleaning for samples like graphene, carbon nanotube, DLC (diamond like carbon), carbon fiber or TEM samples on holey carbon grid. Tergeo is an automatic tabletop plasma cleaner for research laboratories and low volume production, and Tergeo plus is a large chamber tabletop plasma cleaner for R&D, low to mid volume production.


PIE tabletop plasma cleaners include Tergeo, Tergeo plus and Tergeo EM plasma treatment systems.

Tergeo-EM plasma cleaner

Tabletop plasma cleaner for contamination removal on SEM and TEM samples

Tergeo-EM plasma cleaner is a special edition of Tergeo series plasma cleaner designed for SEM/TEM sample cleaning application. It replaces the quartz window in standard Tergeo plasma cleaner with a stainless steel adapter that can accept two TEM sample rods from different TEM vendors. Pin-mount SEM sample holders can be placed on the internal quartz plate for cleaning.


Most SEM users are familiar with the dark burn mark in SEM images. Those dark scan marks are e-beam induced hydrocarbon deposition. Due to low secondary electron yield for carbon element, hydrocarbon coated surface is usually much darker than clean surfaces, especially for SE (secondary electron) imaging at relatively low landing energy, such as 1000eV. Hydrocarbon contaminations on sample surface can significantly reduce the materials contrast at low landing energy, degrade image resolutions for high-resolution FE-SEM. To take advantage of high resolution capability on FE-SEM, it's important to remove the hydrocarbon contamination from the sample surface.


Tergeo-EM plasma cleaner is the only TEM/SEM plasma cleaner that has integrated both immersion mode plasma cleaning (samples are immersed in plasma) and downstream mode plasma cleaning (samples are placed outside the plasma) in one system. Downstream plasma clean totally eliminate the ion sputtering of samples. In addition, unique pulsed modeoperation can generate extremely short plasma pulses to further reduced the plasma intensity for delicate samples. Patented plasma sensor technology monitors the plasma strength in real time. It helps user to set up right cleaning recipe for different types of samples.


Left: Immersion mode plasma cleaning, plasma is generated inside the sample chamber. Samples are immersed in plasma.

Right: Remote plasma cleaning mode, plasma is generated inside the remote plasma source. No ions in sample chamber!

Pulsed operation

Pulsed plasma sometimes can change discharge chemistry and alter the properties of the deposited film compared with traditional CW plasma. Research also indicates that etch/deposition rate can be maintained in pulsed operation despite lower average power. In the meantime, "dust" particle formation, trenching, notching, and charging damage can be reduced. For fluorocarbon PECVD process, pulsed operation can yield rougher surface structure and providing greater hydrophobicity. Tergeo plasma system can be pulsed at 480Hz. Duty ratio can be varied from 1/256 to CW. Pulsed operation on Tergeo plasma treatment system provide a new dimension for researchers to explore the novice characteristics of plasma processing for etching and film deposition.

Tergeo-EM plasma cleaner can meet all the requirements from high speed cleaning for heavily contaminated apertures and electrodes in electron optics column to gentle cleaning for samples like graphene, carbon nanotube, DLC (diamond-like carbon), carbon fiber or TEM samples on holey carbon grid. Tergeo-EM plasma cleaner is equipped with an oil free dry pump safe for oxygen service. Usually air or 80%Ar+20%O2 gas mixture can be used for SEM/TEM sample cleaning application. Two to three mass flow controlled gas delivery ports are available to mix multiple process gases.

Tergeo plasma cleaner

Automatic tabletop plasma cleaner for research laboratories and low volume production

Typical applications:

  • Wire bonding, flip chip underfill, device encapsulation and decapsulation
  • SEM/TEM sample cleaning for carbonaceous contamination removal and oxide reduction
  • Optics, glass and substrate cleaning before epoxy bonding
  • Photoresist ashing, descum and silicon wafer cleaning
  • PDMS, microfluidics, glass slides and lab-on-a-chip
  • Improve bonding for metal to metal or composite
  • Improve bonding for plastic, polymer and composite materials

Tergeo-plus plasma cleaner

Large chamber tabletop plasma cleaner for R&D, low to mid volume production.

The only difference between Tergeo-plus and Tergeo plasma cleaner is the size of the sample chamber. The inner diameter of the sample chamber has been increased from 110mm in Tergeo to 160mm in Tergeo-plus. The depth of the sample chamber is the same, e.g. 280mm.

Application of Tergeo-plus plasma cleaner is similar as the standard Tergeo plasma cleaner, except that it can accommodate larger samples. Here are list of typical applications:

  • Wire bonding, flip chip underfill, device encapsulation and decapsulation
  • Photoresist ashing, descum and silicon wafer cleaning
  • PDMS, microfluidics, glass slides and lab-on-a-chip
  • SEM/TEM sample cleaning for hydrocarbon contamination removal
  • Improve bonding for metal to metal or composite
  • Improve bonding for plastic, polymer and composite materials


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